Ilaphu liBakelwe iPhepha le-PTFE

I-Raw Materials: I-DuPont PTFE resin (USA) okanye i-Daikin PTFE resin (eJapan), ene-glass fiber blended fabric njengenkxaso.
Inkqubo: I-RANA iyanyibilika kuqala kwaye idibanise i-PTFE resin enelaphu elidityanisiweyo ngenkqubo "eshushu-icinezele ukunyibilika", ukuzuza ukudityaniswa kabini kwe "chemical bonds + mechanical bonds" phakathi kweresin kunye nelaphu (bonding force>=7N/cm).

Undoqo: Iimpawu "eziqinileyo-eziguquguqukayo" zelaphu elidityanisiweyo zenza i-Lining Sheet ibe ngaphezulu kunenye-ifayibha exhaswa AMashiti ngokomelela kwempembelelo (15kJ/m²) kunye nokuxhathisa kokukreqa (deformation Ngaphantsi okanye ilingana ne-0.3% emva kweeyure ze-1000 kwi-200℃), ukuhlangabezana neemeko zokusebenza ezahlukeneyo.
Izinto eziluncedo: Ukuqinisekiswa yi-SMIC, akukho ukuchithwa kwamasuntswana okwenzekayo xa kusetyenziswe kwiindawo eziphakamileyo ze-semiconductor - ezicocekileyo (i-Class 10 i-workshop ecocekileyo) (ubungakanani besuntswana Ngaphantsi okanye bulingana ne-0.1μm), kunye noluhlu lokumelana nokushisa kwe-200℃ukuya kwi-260℃kunye nenqanaba lenkqubo ehamba phambili kumazwe ngamazwe.

Iimeko zeSicelo: Isetyenziswa kwi-semiconductor ephezulu{0}}izixhobo ezicocekileyo (umzekelo, i-electronic{3}}iitanki zokugcina i-hydrogen peroxide) kunye noshishino lwemichiza oluchanekileyo (umzekelo, iiketile zokuxutywa kweyeza eziphakathi) ezifuna ukucoceka okuphezulu kunye nokuthembeka. Incede abathengi baphucule imveliso yemveliso (umzekelo, isivuno se-chip sinyuke nge-3%) kunye nokunciphisa iingozi zongcoliseko ezibangelwa kukuchithwa kwe-Lining Sheet.

Iifayile ezishisayo: Ilaphu elixhaswa ngelaphu le-PTFE, Ilaphu laseTshayina lixhaswa ngabavelisi bephepha le-PTFE, ababoneleli, umzi-mveliso